FC-PGA processors fit into zero insertion force (ZIF) motherboard sockets; similar packages were also used by AMD.A ceramic pin grid array (CPGA) is a type of packaging used by integrated circuits.An organic pin grid array (OPGA) is a type of connection for integrated circuits, and especially CPUs, where the silicon die is attached to a plate made out of an organic plastic which is pierced by an array of pins which make the requisite connections to the socket.Plastic pin grid array (PPGA) packaging was used by Intel for late-model Mendocino core Celeron processors based on Socket 370.SPGA packages are usually used by devices that require a higher pin density than what a PGA can provide, such as microprocessors.
The pin grid array at the bottom of prototype
Motorola 68020
microprocessor